Tape Remover

The Wafer Tape Remover Model (DXR, STP series) is designed for the latest technology of back-grinding processes. The Tape Removal System uses a 180° peeling method to achieve a minimum stress on the ground wafer. Fiber optic sensor system prevents the removal of tape from broken wafers.

Peeling of ultra-thin wafers

Minimum tape consumption

Optional high-power UV lamp

Wafer size 100 to 200 mm

Compact Footprint with excellent space factor

Minimized risk for Electrostatic Discharge (ESD) by ionized airflow

Metal porous chuck

More details could be found at Teikoku Taping's web site