Wafer Mounter

The Wafer Mounter automatically orients a wafer on a dicing frame. The wafer is moved from the loading cassette and positioned on the alignment table with respect to X/Y and q (Theta) and then loaded on the wafer stage. During this process, the wafer front side does not contact by the patented wafer table except for the periphery edge of the wafer. Wafer and frame are mounted by adhesive tape. The patented round roller cutter assures a clean uniform edge and safe cut. This minimizes the risk of damage to the frame. The Wafer Mounter ATM Model is designed for 100 mm - 200 mm wafers, the DXM Model is designed for 300 mm wafers and both are able to automatically read the wafer ID and inprint the barcode label (optional).

Maintenance-free, long lifetime roller cutter

Non-contact wafer table (world-wide patented) Tape tension can be adjusted according to tape width

Roller pressure can be adjusted according to a wide variety of wafer or tape

60 - 100 wafer per hour (depending on options)

Options:

Vision system CCD camera (adjust position and angle X, Y, q )

Wafer ID tracking system

Barcode system (ID reader, barcode printer)

Independent X-Y direction tape tensioner (10 steps adjustable)

SECS I/II communication (full SECS/GEM compatible)

More details could be found at Teikoku Taping's web site