Tape Laminator

The Wafer Tape Laminator Model (DXL, STL MK II series) is used for the latest technology of back-grinding processes. The unique patented non-contact Laser Cutting System (DXL series) and Hot Wire Cutting System (STL MK II series) accurately trim the tape to the exact wafer profile including wafer flat and notch.

Patented non-contact laser cutting system (DXL series) trims the tape and provides ultimate wafer protection

Ability to process ground and rework wafers

Minimum tape consumption

Wafer size 100 to 200 mm

Compact Footprint with excellent space factor

Minimized risk for Electrostatic Discharge (ESD) by ionized airflow and metal porous chuck (option)

More details could be found at Teikoku Taping's web site