April 2010:

Tegal Corporation, (Nasdaq: TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, announced on April 20 it has appointed veonis Technologies GmbH, Puchheim, Germany, as its agent for silicon DRIE and dielectric DRIE products in Germany.

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December 2009:

Our offices are closed from Dec. 24, 2009 till Jan 3, 2010. A service hot line will be available at +49 (0)89 800 85 0.

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September 2009:

Semicon Europa 2009 will be held from October 6 - 8, 2009 at Dresden Messe. veonis Technologies will exhibit at a premier location in booth 4.235 in hall 4.

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December 2008:

Our offices are closed from Dec. 24, 2008 till Jan 1, 2009. A service hot line will be available at +49 (0)89 800 85 0.

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September 2008:

Semicon Europa 2008 will be held from October 7 - 9, 2008 at the Stuttgart Trade Fair Center. The exhibition is conveniently located right across the Stuttgart airport terminal. veonis Technologies will exhibit at a premier location in booth 920 in hall 1. We are very much looking forward to meeting you there for a technical discussion or for just catching up.

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February 2008:

A leading European manufacturer of semiconductor power devices has placed a multi-system order for SAWATEC Rinser/Dryer RD-150.
This customer will use the newly developed equipment for capacity expansion within his fab. The equipment from SAWATEC has been selected for its technical excellence and economic benefits. The equipment features automatic mass balancing so that cassettes with different numbers of wafers can be placed into the spin dryer.
The tool allows the usage of a wide range of wafer sizes. Size conversion is achieved within a few seconds. A unique fixturing of the wafer cassette eliminates stress and wear during high speed spinning. Low Cost of Ownership and fast and comprehensive support from veonis Technologies GmbH were important economic factors for the customer’s decision.
The first unit of the equipment has shipped in early January. The remaining multiple units will be delivered in March 2008.

January 2008:

A leading multinational manufacturer of advanced 300 mm wafers has selected Chapman Instruments’ flagship product. For the new 300 mm wafer fab, the MP3100 was chosen for in-line monitoring of surface roughness on frontside and backside and edge roughness including bevel and apex measurements. Based on Chapman’s high resolution optical measurement technology, the MP3100 offers highly accurate, operator-independent results. The MP3100 is the de-facto industry standard for wafer edge roughness, taper and roll-off measurements on 300 mm wafers. The scheduled delivery date is July 2008.

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November 2007:

A leading European manufacturer of devices for automotive applications has placed a multi-system order for CDE ResMap model 168. This customer has used various CDE models across several fabs. For the 200 mm fab expansion CDE and veonis Technologies GmbH were selected due to un-surpassed Cost of Ownership and applications support. The ResMap systems will be used in the implant and PVD sections. The equipment is scheduled to be delivered before the end of year 2007.

October 2007:

Semicon Europa Stuttgart October 9 -11: veonis Technologies will exhibit at booth 922 in hall 1

October 2007:

New short form catalogue available. Please contact us for your personal copy.

January 2006:

Newsletter VO!CE Edition 8/2006 available as download.