Non-Contact Surface Profiling System MPS

The MPS is Chapman Instruments’ next generation of non-contact surface and edge profiler with primary focus on matching future requirements of the wafer manufacturing industry. The system was redesigned for more efficient surface measurements and analysis. The MPS utilizes the same non-contact optical measurement technology as other Chapman profilers. Additionally, the system is integrated with an edge grip robot for 300 mm wafers or a paddle robot for 150mm, 200mm and 300mm wafers.

The MP2100 offers the following key features:

0.01 nm height resolution

50 nm sampling

0.50 µm lateral resolution

Wafer planar and edge measurements (front/back side, front/back bevel apex)

360 degrees circular measurements any surface including edge

Capability for polished and/or roughed wafers both planar and edge

More details could be found at Chapman Instruments' web site